导线(体)宽度：conductor width
导线距离：conductor spacing
导线层：conductor layer
导线宽度/间距：conductor line/space
第一导线层：conductor layer No.1
圆形盘：round pad
方形盘：square pad
菱形盘：diamond pad
长方形焊盘：oblong pad
子弹形盘：bullet pad
泪滴盘：teardrop pad
雪人盘：snowman pad
V形盘：V-shaped pad
环形盘：annular pad
非圆形盘：non-circular pad
隔离盘：isolation pad
非功能连接盘：monfunctional pad
偏置连接盘：offset land
腹(背)*盘：back-bard land
盘址：anchoring spaur
连接盘图形：land pattern
连接盘网格阵列：land grid array
孔环：annular ring
元件孔：component hole
安装孔：mounting hole
支撑孔：supported hole
导通孔：via
镀通孔：plated through hole (PTH)
余隙孔：access hole
盲孔：blind via (hole)
埋孔：buried via hole
埋/盲孔：buried /blind via
任意层内部导通孔：any layer inner via hole (ALIVH)
全部钻孔：all drilled hole
定位孔：toaling hole
无连接盘孔：landless hole
中间孔：interstitial hole
无连接盘导通孔：landless via hole
引导孔：pilot hole
端接全隙孔：terminal clearomee hole
准表面间镀覆孔：quasi-interfacing plated-through hole
准尺寸孔：dimensioned hole
在连接盘中导通孔：via-in-pad
孔位：hole location
孔密度：hole density
孔图：hole pattern
钻孔图：drill drawing
装配图：assembly drawing
印制板组装图：printed board assembly drawing
参考基准：datum referan
