印制线路：printed wiring
印制板：printed board
印制板电路：printed circuit board (PCB)
印制线路板：printed wiring board(PWB)
印制元件：printed component
印制接点：printed contact
印制板装配：printed board assembly
板：board
单面印制板：single-sided printed board(SSB)
双面印制板：double-sided printed board(DSB)
多层印制板：mulitlayer printed board(MLB)
多层印制电路板：mulitlayer printed circuit board
多层印制线路板：mulitlayer prited wiring board
刚性印制板：rigid printed board
刚性单面印制板：rigid single-sided printed borad
刚性双面印制板：rigid double-sided printed borad
刚性多层印制板：rigid multilayer printed board
挠性多层印制板：flexible multilayer printed board
挠性印制板：flexible printed board
挠性单面印制板：flexible single-sided printed board
挠性双面印制板：flexible double-sided printed board
挠性印制电路：flexible printed circuit (FPC)
挠性印制线路：flexible printed wiring
刚性印制板：flex-rigid printed board, rigid-flex printed board
刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
齐平印制板：flush printed board
金属芯印制板：metal core printed board
金属基印制板：metal base printed board
多重布线印制板：mulit-wiring printed board
陶瓷印制板：ceramic substrate printed board
模塑电路板：molded circuit board
模压印制板：stamped printed wiring board
顺序层压多层印制板：sequentially-laminated mulitlayer
散线印制板：discrete wiring board
微线印制板：micro wire board
积层印制板：buile-up printed board
积层多层印制板：build-up mulitlayer printed board (BUM)
积层挠印制板：build-up flexible printed board
表面层合电路板：surface laminar circuit (SLC)
埋入凸块连印制板：B2it printed board
多层膜基板：multi-layered film substrate(MFS)
层间全内导通多层印制板：ALIVH multilayer printed board
载芯片板：chip on board (COB)
埋电阻板：buried resistance board
母板：mother board
子板：daughter board
背板：backplane
*板：bare board
键盘板夹心板：copper-invar-copper board
动态挠性板：dynamic flex board
静态挠性板：static flex board
可断拼板：break-away planel
电缆：cable
挠性扁平电缆：flexible flat cable (FFC)
薄膜开关：membrane switch
混合电路：hybrid circuit
厚膜：thick film
厚膜电路：thick film circuit
薄膜：thin film
薄膜混合电路：thin film hybrid circuit
互连：interconnection
导线：conductor trace line
齐平导线：flush conductor
传输线：transmission line
跨交：crossover
板边插头：edge-board contact
增强板：stiffener
基底：substrate
基板面：real estate
导线面：conductor side
元件面：component side
焊接面：solder side
印制：printing
网格：grid
图形：pattern
导电图形：conductive pattern
非导电图形：non-conductive pattern
字符：legend
标志：mark
